Email Us
Seamark ZM Technology Co., Ltd.

What Are the Product Specifications of SEAMARK's Hot Air BGA Rework Station?

Characteristics of a Hot Air BGA Rework Station


The hot air BGA rework station is a specialized piece of equipment used for the repair and rework of electronic components, particularly suited to handling chips with BGA (Ball Grid Array) packaging. The hot air BGA rework station uses hot air as the heat source, blowing hot air onto the BGA package through a hot air gun or nozzle to achieve soldering. Its temperature rises relatively slowly and its thermal efficiency is relatively low, but it provides relatively uniform temperature control, making it suitable for temperature-sensitive components. It integrates various functions such as a hot air gun, preheating station, and electric soldering iron, enabling efficient heating and desoldering of BGA chips soldered onto motherboards or other electronic components. Due to its uniformity in temperature control, the hot air bga rework station is typically used in situations that require precise temperature control, especially in lead-free soldering environments, where it may provide nitrogen protection to prevent metal oxidation.

SEAMARK's Hot Air BGA Rework Station Features


SEAMARK is one of the leading BGA rework station suppliers and offers the following features in its hot air BGA rework stations.


  • Temperature curve setting.


  • High-definition touch screen operation allows real-time display and editing of temperature curves. Each set of temperature curves can be divided into 8 sections, and up to 100 sets of temperature curves can be stored, with an auto-temperature calibration feature.


  • Laser red dot positioning guidance.


  • Laser indication for PCB and component positioning.


  • Vacuum adsorption.


  • External vacuum pick-up tool for easy placement and removal of BGA.


SEAMARK's Hot Air BGA Rework Station Specifications


Power Supply


AC220V±10% 50/60HZ


Power


5.0KW (maximum), Top Heater (0.8KW), Bottom Heater (1.2KW), Infrared Preheater (2.7KW), Others (0.3KW)


PCB Size


410*370mm (maximum); 10*10mm (minimum)


BGA Chip Size


40*40mm (maximum); 10*10mm (minimum)


Infrared Heater Size


375*285mm


Operation Method


High-definition touch screen


Control System


Proprietary heating control system V1


Positioning System


Laser dot


Dimensions


L635*W620*H655mm


The Usage Precautions of Hot Air BGA Rework Station


Safe Usage


Ensure to follow safe operation procedures when using the hot air BGA rework station to ensure personal and equipment safety.


Regular Maintenance


Conduct regular cleaning and maintenance of the equipment to keep it in good condition.


Professional Operation


It is recommended that the equipment be operated by professional or trained personnel to ensure repair quality and equipment safety.

Related News
Resources Products
Company News
F3,Building 11, Longwangmiao Industrial Zone, Baishixia Community, Fuyong, Bao'an, Shenzhen.
jackie@zhuomao.com.cn
0086-0755-29929955