AXI X-ray (Automatic X-Ray Inspection) is an advanced non-destructive testing technology based on the penetrative principle of X-rays. By accurately detecting the internal structure and defects of products, it provides significant support for quality control and fault prevention. According to the understanding of various detection technologies and equipment, AXI X-ray automatic detection technology has many advantages. It can significantly enhance our detection systems. It offers an effective testing method to improve our "first pass yield" and strive for the goal of "zero defects".
AXI X-ray inspection technology has emerged as a new testing technology in recent years. When an assembled printed circuit board (PCBA) enters the machine along the rail, an X-ray emitter tube located above the circuit board shoots X-rays through the board, which are then received by a detector (usually a camera) positioned below. Since the solder joints contain lead, which can absorb a significant amount of X-rays, the X-rays irradiating the solder joints are largely absorbed compared to those passing through other materials like fiberglass, copper, and silicon, presenting black spots and producing a clear image. This makes analyzing solder joints relatively intuitive, allowing simple image analysis algorithms to automatically and reliably detect solder defects.
High coverage of process defects, up to 97%. The detectable defects include insufficient soldering, bridging, tombstoning, insufficient solder, voids, component misplacement, etc. Especially, X-ray can inspect hidden components such as BGA and CSP solder joints.
High test coverage. It can inspect areas that are not detectable by the naked eye or online testing. For instance, if a fault is suspected to be caused by a broken trace on an inner layer of the PCB, X-ray can quickly perform the inspection.
Significantly shortened test preparation time.
Can detect defects that other testing methods cannot reliably observe, such as insufficient soldering, air voids, and poor molding.
Requires only one inspection for double-sided and multilayer boards (with layering functionality).
Provides relevant measurement information for evaluating the production process, such as solder paste thickness and the amount of solder under the solder joint.
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