PCB X-ray inspection is a technology that utilizes X-ray penetration to perform a perspective inspection of PCB boards. It is widely used in the electronics manufacturing industry to ensure the production quality of PCB boards.
The basic principle of SEAMARK's PCB X-ray is the utilization of the penetrative ability of X-rays. When X-rays pass through a PCB board, materials of different types and thicknesses will absorb the X-rays to varying degrees, thus forming different images on the detector. These images can clearly display the internal details of the PCB board such as wires, solder joints, components, as well as potential defects and failures.
Solder Joint Quality Inspection
Inspect the quality of solder joints, including the shape, size, position of the solder joints, and whether there are defects such as cold solder joints or missing solder.
Component Inspection
Check whether the components on the PCB board are intact, misplaced, or missing.
Internal Defect Detection
Detection of internal defects such as cracks, bubbles, inclusions, etc.
BGA and CSP Package Inspection
For PCB boards with high-density packages such as BGA (Ball Grid Array) and CSP (Chip Scale Package), X-ray inspection is an important means to assess their soldering quality and packaging integrity.
The PCB X-ray inspection systems are mainly divided into two-dimensional (2D) systems and three-dimensional (3D) systems:
2D X-ray Systems
Capable of simultaneously displaying 2D images of all components on both sides of the PCB, suitable for detecting defects in solder joints, metal traces on circuit boards, internal connections, and welding quality. This system has a fast imaging speed but may not provide detailed information in three-dimensional space.
3D X-ray Systems
Capable of three-dimensional scanning and reconstruction of the overall structure and components of electronic devices, providing more comprehensive information about internal structures and defects. This system is usually used for chip inspection, assembly, and soldering, making it faster to locate and solve problems.
High Precision
Capable of non-destructive detection of micro defects inside the PCB board.
Comprehensive Inspection
Able to cover the entire area of the PCB board, including hard-to-reach corners and hidden areas.
Automation
Combined with artificial intelligence technology, it can achieve automated detection and defect recognition, improving detection efficiency and accuracy.
As a high-precision, non-destructive detection technology, PCB X-ray inspection plays a crucial role in the electronics manufacturing industry. With the continuous advancement of technology and the gradual reduction of costs, it is expected to be applied and promoted in broader areas. At the same time, combining it with other detection methods and artificial intelligence technology can further enhance detection efficiency and accuracy, providing strong support for quality control in the electronics manufacturing industry.
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