An infrared BGA rework station is a specialized equipment used for the rework of electronic components, especially for BGA (Ball Grid Array) chips and other irregular devices. The infrared rework station uses infrared radiation heating technology to precisely heat electronic components locally, enabling the removal, soldering, and reassembly of components. It is usually equipped with a high-precision temperature control system and an optical alignment system to ensure the accuracy and stability of the rework process. Infrared rework stations are widely used in the repair and maintenance fields of the electronics manufacturing industry, particularly in high-end communications, automotive electronics, industrial control, and high-end consumer electronics. These fields have higher requirements for the reliability and stability of electronic components, making infrared rework stations indispensable rework equipment.
Infrared heating as the main method
Infrared BGA rework stations primarily use infrared heating. Through infrared radiation, BGA components are evenly heated, causing the solder to melt and allowing the removal and re-soldering of components. Infrared heating has advantages such as strong penetration, fast heating speed, and high thermal efficiency.
PID intelligent temperature control technology
Using advanced PID intelligent temperature control technology, it can monitor the temperature of the heating area in real-time and accurately adjust the heating power and time through a feedback control system. This ensures that components and PCB boards are not damaged during the rework process. This temperature control method makes the temperature curve more perfect, effectively avoiding damage that might be caused by rapid or continuous heating.
Wide applicability
Suitable for the rework of BGA, CSP, PoP, WLCSP, QFN, and other devices on various PCBA substrates such as servers, PC motherboards, tablets, and smart terminals. It has strong adaptability and flexibility.
Precise heating and temperature control
Infrared BGA rework stations use infrared radiation technology to precisely and evenly heat target components. This heating method can quickly reach the required temperature while reducing thermal impact on adjacent components. The workstation is equipped with a high-precision temperature control system that can accurately control the heating temperature, ensuring the stability and reliability of the heating process.
Component removal
During the rework process, it is often necessary to remove defective or damaged components from the PCB board. Infrared BGA rework stations can achieve damage-free or low-damage removal by precisely heating and melting the solder of the components. This is crucial for maintaining the integrity of the PCB board and surrounding components.
Component soldering
After removal, the infrared BGA rework station can also be used for soldering new components. By controlling the heating temperature and soldering time, the station ensures a good connection between the new components and the PCB board, enhancing soldering quality and reliability.
Optical alignment and positioning
To ensure that components can be accurately and correctly soldered to the PCB board, infrared BGA rework stations are often equipped with high-precision optical alignment systems. This system can display the positional relationship between the components and the PCB pads in real-time, assisting operators in precise alignment and positioning.
As one of the suppliers of infrared BGA rework stations, Seamark ZM has strong technical capabilities, comprehensive testing methods, reliable product quality, and comprehensive services. Adhering to the concept of "customer first," the company strives to develop technologies and looks forward to providing customers with more product choices.
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