The combination of X-ray inspection for electronic components with artificial intelligence technology allows for high-accuracy, non-destructive internal imaging of PCB and chip assemblies, and automatic defect identification. This helps users in the electronics assembly industry achieve efficient, stringent quality control in high-complexity, high-intensity production competition.
X-ray inspection for electronic components can detect the solder joints, pins, and internal structures of electronic components. It has been widely used in quality monitoring and failure analysis during the production process of electronic products in the electronics assembly industry, improving inspection efficiency and accuracy.
According to the inspection requirements and solutions, X-ray inspection for electronic components mainly includes two forms: 2D and 3D.
2D X-ray inspection for electronic components technology, with its outstanding imaging capabilities, not only allows for in-depth observation of the fine structure of solder joints without destroying the components, ensuring impeccable welding quality but also precisely verifies whether the components are genuine. By meticulously scanning the internal connections and metal traces, this X-ray inspection technology can quickly identify any subtle manufacturing defects or design deviations, effectively preventing circuit failures caused by component quality issues. Notably, 2D X-ray inspection technology can intuitively display the alignment status and connection quality of the pins, ensuring perfect matching between the pins and the PCB board, laying a solid foundation for the stable operation of electronic products.
3D X-ray inspection for electronic components technology acts like a precise "internal scanner" that can capture three-dimensional structural information of electronic devices in all directions and angles, achieving high-precision 3D reconstruction. This characteristic makes it a powerful tool for identifying electronic components with similar appearances but vastly different internal structures. In fields such as chip inspection, complex assembly, and precision welding, 3D X-ray inspection can quickly penetrate surfaces, revealing hidden internal structural differences, assisting engineers in accurately determining the true identity and performance of components. Additionally, this X-ray inspection technology can significantly shorten the new product development cycle by quickly identifying and resolving potential issues in design or manufacturing, accelerating the transformation of products from concept to market, and enhancing market competitiveness.
The working principle of X-ray inspection for electronic components technology primarily utilizes the penetrating effect of X-rays. Given that X-rays have short wavelengths and high energy, when they irradiate a substance, the substance can only absorb a small portion, but most of the X-ray energy passes through the gaps between the atoms of the substance, displaying very strong penetration capabilities, similar to taking a chest X-ray in a hospital.
The solutions for X-ray inspection for electronic components technology are mainly divided into two categories based on customer requirements for inspection accuracy, speed, and automation level:
One category is for high accuracy inspection but low speed requirements, with manual identification. The inspection content involves checking weld seams, important component defects, laboratory analysis, and solder joint inspection of integrated circuit boards, among other fields;
The other category is for online inspection of workpieces on the production line, requiring high inspection speed (efficiency). It can automatically calibrate defect positions or automatically remove non-conforming products via computer. In the context of increasing automation levels in factory production, it is broadly applied in cooperation with automated production line inspections of workpieces.
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