Seamark ZM - 2017 newest Desktop X-ray inspection system X5600

 Application                                              
Cell phone motherboard

laptop motherboard

LED lamp beads

Electronic components

Packaged components

Earphone module 

 

Standard Configuration

Name

QTY(Pcs)

Remark

80KV-10um close X Tube

1

 

Object Stage

1

Size:250*250MM

Flat Panel Detector

1

Full digital HD

Image processor CPU

1

Fully functional

Liquid crystal display

1

24"

 


Full Automatic BGA Testing Procedures                                
1. A simple mouse click programming without the need for operator intervention on the component can detects each BGA automatically.
2. Automatic BGA test, accurately check the bridge, Welding, cold welding and void ratio of BGA.
3. Automatic BGA test repeatable test results in order to process control
4. The test results will be displayed on the screen and can be output  to Excel to facilitate review and archiving

NC Programming                                        
1.A simple mouse clicks operation write test procedures
2.The stage can be X, Y director positioning; X-ray tube and detector Z positioning.
3.Software setting voltage and current
4.Image settings: brightness, contrast, auto gain and exposure
5.The user can set the program switch pause time

6.Anti-collision system can meet the maximum tilt and observe objects

 

Typical X-Ray Applications:

1> 2D imaging

 

2> Color image

 

3>Circuit Board Inspection.Circuit board testing automated testing of BGA welding area, bubbles and air (Open), short circuits, offset, round, Tin lost the ball.

 

Bridging, standard BGA bridge (cause: solder paste too much solution: check the press machine)

 

Cold Solder, Standard BGA Cold Welding (Possible Cause: No Melting Temperature Solution: Check Reflow )

 

Check the solder paste, BGA open (Possible reasons: solder printing problems, solder missing, poor solderability. Solution: Check the press)

 

4>Semi-Conductor,Internal wire bonding inspecetion

 

5>Inspection ofinternal part of a capacitor.

 

6> Lithium battery detection.Measuring the distance between the cathode and cathode of the lithium battery

 

7>Detection of electric heating tube

Check the quality of the resistance wire inside the heating tube

 

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 Application                                              
Cell phone motherboard

laptop motherboard

LED lamp beads

Electronic components

Packaged components

Earphone module 

 

Standard Configuration

Name

QTY(Pcs)

Remark

80KV-10um close X Tube

1

 

Object Stage

1

Size:250*250MM

Flat Panel Detector

1

Full digital HD

Image processor CPU

1

Fully functional

Liquid crystal display

1

24"

 


Full Automatic BGA Testing Procedures                                
1. A simple mouse click programming without the need for operator intervention on the component can detects each BGA automatically.
2. Automatic BGA test, accurately check the bridge, Welding, cold welding and void ratio of BGA.
3. Automatic BGA test repeatable test results in order to process control
4. The test results will be displayed on the screen and can be output  to Excel to facilitate review and archiving

NC Programming                                        
1.A simple mouse clicks operation write test procedures
2.The stage can be X, Y director positioning; X-ray tube and detector Z positioning.
3.Software setting voltage and current
4.Image settings: brightness, contrast, auto gain and exposure
5.The user can set the program switch pause time

6.Anti-collision system can meet the maximum tilt and observe objects

 

Typical X-Ray Applications:

1> 2D imaging

 

2> Color image

 

3>Circuit Board Inspection.Circuit board testing automated testing of BGA welding area, bubbles and air (Open), short circuits, offset, round, Tin lost the ball.

 

Bridging, standard BGA bridge (cause: solder paste too much solution: check the press machine)

 

Cold Solder, Standard BGA Cold Welding (Possible Cause: No Melting Temperature Solution: Check Reflow )

 

Check the solder paste, BGA open (Possible reasons: solder printing problems, solder missing, poor solderability. Solution: Check the press)

 

4>Semi-Conductor,Internal wire bonding inspecetion

 

5>Inspection ofinternal part of a capacitor.

 

6> Lithium battery detection.Measuring the distance between the cathode and cathode of the lithium battery

 

7>Detection of electric heating tube

Check the quality of the resistance wire inside the heating tube

 

 

1

X-RAY launch tube

Tube type

Closed X-ray tube

Maximum tube voltage

80KV(90kV,100kV110kV,120kV optional)

Maximum tube current

0.5mA

Focal size

10um

Magnification

Geometric magnification: 50    

System magnification: 300X

2

Detector

Image speed

35fps

Detector

1124*1000

Tilt angle

Probe 30 ° tilt

3

Cabinet Specifications

Stage size

250mm*250mm

Cabinet Specifications

260kg

Dimensions

600mm*600mm*800mm

Cabinet Specifications

AC 110-220V+10%(international standard power supply)

4

X-ray leakage amount

≤1 u Sv/h

5

operating system

Windows 7

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Please contact us at   seamark@zhuomao.com.cn  for further information