2017 X-ray Inspection Machine/Equipment/System for Electronic Components X6600

Application                                           

Surface mount device

Electronic component

Plastic Products

PCBA solder joint detection (BGA, CSP, POP, QFN and other components)

 

Standard Configuration

Name

QTY(Pcs)

Remark

90KV-5um close X Tube

1

Object Stage

1

Size:640*540MM

Flat Panel Detector

1

Full digital HD

Image processor CPU

1

Fully functional

Liquid crystal display

1

24"

                                          

Object Stage Control                                               
1. by the spacebar to adjust stage speed: slow, constant and fast speed
2. Keyboard control X, Y, Z three-axis motion and inclined angle 
3. The user can control the stage speed and angle programmatically

4.Large navigation window, easy to locate and identify defective products
5.Click on the mouse to controlled stage

6.Visual screen with floating button

7.through mouse control stage in the Visual screen

Full Automatic BGA Testing Procedures                                  
1. A simple mouse click programming without the need for operator intervention on the component can detects each BGA automatically.
2. Automatic BGA test, accurately check the bridge, Welding, cold welding and void ratio of BGA.
3. Automatic BGA test repeatable test results in order to process control
4. The test results will be displayed on the screen and can be output  to Excel to facilitate review and archiving

NC Programming                                          
1.A simple mouse clicks operation write test procedures
2.The stage can be X, Y director positioning; X-ray tube and detector Z positioning.
3.Software setting voltage and current
4.Image settings: brightness, contrast, auto gain and exposure
5.The user can set the program switch pause time

6.Anti-collision system can meet the maximum tilt and observe objects

7.Automatic analysis of BGA diameter, void ratio, area and roundness

 

Typical X-Ray Applications

1> 2D imaging


2>Circuit Board Inspection.Circuit board testing automated testing of BGA welding area, bubbles and air (Open), short circuits, offset, round, Tin lost the ball.

 

Bridging, standard BGA bridge (cause: solder paste too much solution: check the press machine)

 

Cold Solder, Standard BGA Cold Welding (Possible Cause: No Melting Temperature Solution: Check Reflow )

 

Check the solder paste, BGA open (Possible reasons: solder printing problems, solder missing, poor solderability. Solution: Check the press)

 

3>Semi-Conductor,Internal wire bonding inspecetion

 

4>Inspection ofinternal part of a capacitor.

 

5> Lithium battery detection.Measuring the distance between the cathode and cathode of the lithium battery

 

7>Detection of electric heating tube

Check the quality of the resistance wire inside the heating tube

 

8>  Detection of automobile tubing

Detection the cracks inside the tubing, cracks, damage

  • Product Details
  • Specification
  • Make Inquiry
  • Product Video

Application                                           

Surface mount device

Electronic component

Plastic Products

PCBA solder joint detection (BGA, CSP, POP, QFN and other components)

 

Standard Configuration

Name

QTY(Pcs)

Remark

90KV-5um close X Tube

1

Object Stage

1

Size:640*540MM

Flat Panel Detector

1

Full digital HD

Image processor CPU

1

Fully functional

Liquid crystal display

1

24"

                                          

Object Stage Control                                               
1. by the spacebar to adjust stage speed: slow, constant and fast speed
2. Keyboard control X, Y, Z three-axis motion and inclined angle 
3. The user can control the stage speed and angle programmatically

4.Large navigation window, easy to locate and identify defective products
5.Click on the mouse to controlled stage

6.Visual screen with floating button

7.through mouse control stage in the Visual screen

Full Automatic BGA Testing Procedures                                  
1. A simple mouse click programming without the need for operator intervention on the component can detects each BGA automatically.
2. Automatic BGA test, accurately check the bridge, Welding, cold welding and void ratio of BGA.
3. Automatic BGA test repeatable test results in order to process control
4. The test results will be displayed on the screen and can be output  to Excel to facilitate review and archiving

NC Programming                                          
1.A simple mouse clicks operation write test procedures
2.The stage can be X, Y director positioning; X-ray tube and detector Z positioning.
3.Software setting voltage and current
4.Image settings: brightness, contrast, auto gain and exposure
5.The user can set the program switch pause time

6.Anti-collision system can meet the maximum tilt and observe objects

7.Automatic analysis of BGA diameter, void ratio, area and roundness

 

Typical X-Ray Applications

1> 2D imaging


2>Circuit Board Inspection.Circuit board testing automated testing of BGA welding area, bubbles and air (Open), short circuits, offset, round, Tin lost the ball.

 

Bridging, standard BGA bridge (cause: solder paste too much solution: check the press machine)

 

Cold Solder, Standard BGA Cold Welding (Possible Cause: No Melting Temperature Solution: Check Reflow )

 

Check the solder paste, BGA open (Possible reasons: solder printing problems, solder missing, poor solderability. Solution: Check the press)

 

3>Semi-Conductor,Internal wire bonding inspecetion

 

4>Inspection ofinternal part of a capacitor.

 

5> Lithium battery detection.Measuring the distance between the cathode and cathode of the lithium battery

 

7>Detection of electric heating tube

Check the quality of the resistance wire inside the heating tube

 

8>  Detection of automobile tubing

Detection the cracks inside the tubing, cracks, damage

1

X-RAY launch tube 

Tube type 

Closed X-ray tube 

2

X-RAY launch tube 

Maximum tube voltage 

90kV(90kV,100kV,110kV,120kV optional) 

3

X-RAY launch tube 

Maximum tube current 

0.12mA

4

X-RAY launch tube 

Focal size 

5 um 

5

X-RAY launch tube 

Magnification 

Geometric magnification: 150 X         

System magnification: 1000X 

6

Detector 

Image speed 

20 fps 

7

Detector 

Resolution 

1124*1000

8

Detector 

Slope angle 

Stage 60°Rotation

9

Cabinet Specifications 

Stage size 

640mm*540mm

10

Cabinet Specifications 

Dimension 

1360mm*1685mm *1630mm 

11

Cabinet Specifications 

Net weight 

900kg 

12

Cabinet Specifications 

Input voltage 

AC 110-220V(+10%)(international standard power supply) 

13

X-ray leakage amount 

  

≤1 u Sv/h 

14

operating system 

  

Windows 7 

15

Total power 

  

1.5Kw 

 

  • 图片看不清?点击重新得到验证码
Agree with this Privacy Policy
Please choose if you agree to the privacy policy

Seamark ZM® 2014-2015 All Rights Reserved   UM

Please contact us at   seamark@zhuomao.com.cn  for further information